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INTEGRATION OF DIGITAL IMAGE CORRELATION AND THERMOELASTICITY FOR EXPERIMENTAL ANALYSYS OF OPERATIONAL MODAL SHAPES

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JULY 2024   -  Volume: 99 -  Pages: 410-416

DOI:

https://doi.org/10.52152/D11078

Authors:

ANGEL JESUS MOLINA VIEDMA -
LUIS FELIPE SESE
-
ELÍAS LOPEZ ALBA
-
FRANCISCO ALBERTO DIAZ GARRIDO

Disciplines:

  • Mechanics (MEDIDAS DE PROPIEDADES DINAMICAS )
  • Acoustics (VIBRACIONES )

Downloads:   20

How to cite this paper:  
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Received Date :   9 October 2023

Reviewing Date :   9 October 2023

Accepted Date :   8 January 2024


Key words:
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Article type:
ARTICULO DE INVESTIGACION / RESEARCH ARTICLE
Section:
RESEARCH ARTICLES

Full-field optical techniques provide valuable information for the analysis of mode shapes thanks to their high density of measurement points, providing very detailed maps, in a noninvasive way that avoids alterations of the dynamic behaviour of the specimen. Digital image correlation and thermoelastic stress analysis are two of the most interesting ones. The first provides displacement fields that can be three-dimensional if a calibrated stereoscopic system is used. The second uses a thermographic camera to determine the stress invariant. Given the complementary nature of these magnitudes, this study deals with the integration of the displacement and stress fields by means of a calibrated set of a stereoscopic
system and a thermographic camera which, through spatial triangulation, allow the association of the measurements to the same spatial point on the specimen. For this purpose, typical laboratory setups have been carried out for the characterisation of operational modal shapes of resonances. The integration
has allowed a more accurate interpretation of the behaviour
of the specimen, identifying the regions with the highest
mechanical stress. This shows the advantages of integration
compared to the isolated analysis of displacement and/or
stress measurements that are usually carried out and proves
the potential for the development of optical techniques at a
scientific and industrial level, opening up new avenues of study.

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